Fehonda 8.0W Thermal Pad

Self-adhesive on both sides, not easy to peel off, soft, good compressibility, high reliability in long-term use, can be used for heat transfer between semiconductors, power devices and housings or other heat sinks;

• Thermal Conductivity：8.0 W/m.k

• Hardness：Shore C 30~40

• Thickness：0.5～3.0mm

• Breakdown voltage：＞9 Kv/mm

Fehonda 12.8W Thermal Pad

Self-adhesive on both sides, not easy to peel off, soft, good compressibility, high reliability in long-term use, can be used for heat transfer between semiconductors, power devices and housings or other heat sinks;

• Thermal Conductivity：12.8W/m.k

• Hardness：Shore C 30~45

• Thickness：0.5～3.0mm

• Breakdown voltage：＞9 Kv/mm

Fehonda 15.0W Thermal Pad

Self-adhesive on both sides, not easy to peel off, soft, good compressibility, high reliability in long-term use, can be used for heat transfer between semiconductors, power devices and housings or other heat sinks;

• Thermal Conductivity：15.0W/m.k

• Hardness：Shore C 40~50

• Thickness：0.5～3.0mm

• Breakdown voltage：＞10 Kv/mm
  

Fehonda 14.8W Thermal Paste

Features and Benefits

• Easy to use

• Great surface wetting

• Environmentally safe

• Low thermal impedance

• Excellent long term stability

• Ideal for rework and field repair situation
  

Typical Applications

• Consumer electronics Telecommunications Medical devices Industrial controls

• Between CPU or other heat generating component and a heatsink

• Power semiconductors/Memory modules

• Engine and transmission control modules / Power conversion equipment / Power supplies and UPS
  

Thermal Paste 14.8W

Products Application Videos

Thermal Pads application

Thermal paste application 14.8W